Chemical Mechanical Polishing (CMP) Staff Engineer
Free account needed to apply or save. It takes a minute, and we'll bring you right back to this job.
How well do you match this job?
Key details
- Location
- Bloomington, MN, United States
- Work style
- Onsite
- Level
- Senior
- Experience
- 5–8 yrs
- Function
- Software engineering
- Focus area
- other
- Visa sponsorship
- US citizens only
- Posted
- 3d ago
Skills
process capabilityproject managementspc
About the role
SkyWater is hiring a Chemical Mechanical Polishing (CMP) Engineer to develop or integrate robust manufacturable process recipes for Foundry customers. The job is located at our HQ in Bloomington, MN.
Responsibilities:
Equipment and material characterization as it relates to CMP.
Drive continuous improvement of CMP process capability and controls.
Complex CMP process integration for CMOS/MEMS/Superconducting/Photonics or other novel device types.
Resolve process excursions and drive permanent Root Cause Corrective Actions (RCCA).
Required Qualifications:
Education: Bachelors & Masters in an Engineering discipline, or PhD in an Engineering discipline.
BS with 5 years, MS with 3 years, or PhD with 0-3 years of engineering experience in a semiconductor fab or lab environment.
Fab processing tools knowledge/experience, particularly with CMP processing knowledge/experience.
CMOS/MEMS/Photonic device and integration knowledge with relevant combination of years of experience and/or advanced degree.
Knowledge of DOE, SPC, and 6-sigma concepts and applications.
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
Can work both independently and in cross-functional teams for problem solving.
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Preferred Qualifications:
Project Management skills and/or defined training
Responsibilities:
Equipment and material characterization as it relates to CMP.
Drive continuous improvement of CMP process capability and controls.
Complex CMP process integration for CMOS/MEMS/Superconducting/Photonics or other novel device types.
Resolve process excursions and drive permanent Root Cause Corrective Actions (RCCA).
Required Qualifications:
Education: Bachelors & Masters in an Engineering discipline, or PhD in an Engineering discipline.
BS with 5 years, MS with 3 years, or PhD with 0-3 years of engineering experience in a semiconductor fab or lab environment.
Fab processing tools knowledge/experience, particularly with CMP processing knowledge/experience.
CMOS/MEMS/Photonic device and integration knowledge with relevant combination of years of experience and/or advanced degree.
Knowledge of DOE, SPC, and 6-sigma concepts and applications.
Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
Can work both independently and in cross-functional teams for problem solving.
US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.
Preferred Qualifications:
Project Management skills and/or defined training