Senior Packaging Development Engineer - Substrate Modules
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Key details
- Location
- Malacca, Malaysia
- Work style
- Onsite
- Level
- Senior
- Experience
- 5–8 yrs
- Function
- Software engineering
- Focus area
- other
- Posted
- 3w ago
Skills
dfmfmeajmpmachine operationmaterial selectionprocess controlprocess optimizationproject managementprototypingsmtspcstatistical analysis
About the role
Change the world. Love your job.
As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
- Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology
- Defining simplified manufacturing process sequence for different components attach
- Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product RTM including project documentation
- Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements
- Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
- Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities in the high-volume manufacturing environment
Minimum requirements:
- Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field of study
- Cumulative > 3.3 CGPA and above
- Minimum 5 years' experience in the manufacturing semiconductor field
- Hands on skills in operating machines and knowledge to down-select material, process optimization and yield improvement
Preferred qualifications:
- Package layer design expertise such as structural configuration, material selection and process flow design
- Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.
- Hands on experience on system-in-Package (SiP), including exposed Inductor integration solutions is added advantage.
- Knowledge of power module packaging processes, including understanding of Design for Manufacturability (DFM) constraints and module package defect criteria.
- Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)
- Ability to establish strong and collaborative relationships with stakeholders, global design & manufacturing teams and component/material/substrate supplier to meet on-time execution
- Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
- Knowledge in FMEA methodology, process control plan, statistical analysis, SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
- Experience with assembly of power modules packaging, substrate design and reliability requirements
- Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
- Key personal characters – trustworthy, inclusive, innovative, competitive, result-oriented
Why TI?
- The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture.
- At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.