SMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Bonding)

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

We are advancing next-generation packaging technologies that enable performance, bandwidth, and power efficiency required for modern AI and high-performance computing applications. Our team brings together experts across process development, integration, manufacturing, reliability, and design to solve complex technical challenges and move new technologies from concept to production. If you enjoy working at the intersection of innovation and execution, this is an opportunity to make a meaningful impact.

Position Overview:

As an SMTS Process Integration Engineer for Advanced Packaging, you will lead the integration of 2.5D, 3D stacking, and HBM-based package architectures. This role is central to developing and transferring new packaging technologies, improving yield and reliability, and delivering multi-die solutions for groundbreaking products. You will work closely with multi-functional partners to drive technical decisions, solve integration challenges, and bring new capabilities into manufacturing.

Responsibilities:

• Lead process integration for advanced packaging technologies including 2.5D, 3D stacking, HBM, wafer-to-wafer, and chip-to-wafer architectures
• Develop and optimize integrated manufacturing flows across lithography, etch, deposition, CMP, diffusion, thin films, bonding, and assembly processes
• Design and implement DOEs to evaluate materials, process parameters, and design rules that improve yield, performance, and reliability
• Analyze yield, defect, electrical, and parametric data to identify root causes, improve process capability, and resolve manufacturing issues
• Drive technology transfer, qualification, and production readiness for new advanced packaging solutions
• Develop and optimize bonding, die stacking, underfill, molding, thermal management, and interconnect integration processes
• Collaborate with design, equipment, manufacturing, reliability, and test teams to deliver high-performance package solutions
• Develop and apply AI-enabled workflows, tools, or agents to improve process integration effectiveness and decision-making

Minimum Qualifications:

• Bachelor’s Degree in Materials Engineering, Chemical Engineering, or a related field and 15+ years of related work experience or a Master's degree or PhD in Materials Engineering, Chemical Engineering, or a related field and 10+ years of related work experience.
• 10+ years of experience in advanced packaging technology development, including 2.5D, 3D, and HBM integration
• Experience with advanced interconnects, TSVs, die stacking, bonding, underfill, molding, and package integration processes
• Proficiency with DOE, SPC, and data analysis tools such as JMP, Minitab, or Python, with a track record of yield improvement and root-cause analysis
• Experience leading multi-functional technical initiatives and applying AI tools, workflows, or agents in semiconductor development environments

Preferred Qualifications:

• Experience with bonding, thermocompression bonding, microbump technologies, and associated reliability qualification
• Demonstrated success integrating HBM and logic devices, including thermal optimization and high-I/O package architectures
• Experience with metrology and inspection techniques, including SAM, X-ray/CT, IR microscopy, and warpage measurement systems
• Knowledge of warpage modeling, inline process correlation, and advanced package reliability methodologies
• Experience developing and transferring advanced packaging technologies into high-volume manufacturing

Work Environment & Schedule

·        Cleanroom environment, full gowning; alignment to EHS/cleanroom protocols.

·        Occasional travel to TD sites in Asia for integration development and transfer support.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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